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PM8311 TEMUX® 168
High Density T1/E1 Framer, VT/TU Mapper & M13 Mux with Integrated SONET/SDH Framers

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Version Issue Date

Product Brief

PDFPM8311 TEMUX 168 High Density T1/E1 Framer, VT/TU Mapper & M13 Mux with Integrated SONET/SDH Framers Product Brief [207 KB] PMC-2060577 2007-12-18 

Application Note

Locked Document, Log In RequiredPDFConfiguring SBI Compatible Devices [551 KB] PMC-2020180 2007-11-20 
Locked Document, Log In RequiredPDFAttaching Passive Heat Sinks to Organic Flip Chip Packages [142 KB] PMC-2020246 2007-05-02 

White Papers

PDFATCA Design Considerations for Telecommunication Platforms [815 KB] PMC-2081221 2008-08-14 

Symbols/Footprints

  Version Issue Date
Locked Document, Log In RequiredZipped FilePMC-2072051 PM8311 TEMUX 168 896 FCBGA CAD Symbols and Footprints [616 KB]12007-12-06

Features

PRODUCT OVERVIEW

The PM8311 TEMUX 168 is a single device integrating 2xOC-3/STM-1 SONET/SDH framers for working and protect links, 168/126 T1/E1 framers, 6 DS3/E3 framers, 6 M13/G.747 multiplexers and 6 VT/TU mappers.

Designed for lower-density applications than its PM8310 TEMUX 336 counterpart, the TEMUX 168 device also interfaces seamlessly with a broad range of PMC-Sierra solutions. The TEMUX 168 includes the Extended Serial SONET/SDH interface (ESSI), enabling:

  • A low pin-count interconnect to additional TEMUX 168 devices
  • SONET/SDH cross-connects in transport applications
  • Ethernet over SONET/SDH mappers such as the PMC-Sierra PM4390 ARROW M8xFE

The device also includes the SBI bus, which enables simple interconnects with PMC-Sierra Layer 2 solutions.

The TEMUX 168 is fully hardware and software compatible with the TEMUX 336.

BENEFITS

  • Complete SONET/SDH front end with T1/E1, DS3/E3 framers/mappers/multiplexers on a single-chip that meets ATCA/AMC space and power constraints.
  • Integrated SBI bus simplifies interconnection to layer 2 processors
  • Meets timing requirements for wireless backhaul, critical for CESbased PWE3 applications, by enabling independent timing for all 168/128 T1/E1s across the SBI using the V4 byte
  • Extended Serial SONET/SDH Interface (ESSI) can aggregate up to 2xOC-3/STM-1 on a single 4-wire interface, enabling equipment protection in ACTA/AMC systems.
  • Supports linear 1+1 protection on the same device or to a companion TEMUX 168
  • Enables a scalable architecture from T1/E1 up to OC-12/STM-4
  • Supports T1/E1 mapping directly into SONET/SDH using VT1.5/TU-11 or VT2/TU-12 or multiplexed in DS3s using M13 or G.747
  • Supports advanced test features including programmable pattern generation and detection for up to 64 byte sequences
  • Fully integrated, monolithic IC ensures reliability

PRODUCT HIGHLIGHTS

  • 4 OC-3/STM-1 SONET/SDH framers
  • 168 T1/126 E1 framers
  • 6 M13 multiplexers, including support for G.747 multiplexing
  • 6 DS3/E3 framers
  • High order path processor for a SONET STS-3 or an SDH STM-1
  • Tributary path processor for 168 VT1.5/TU-11s or 126 VT2/TU-12s
  • Byte synchronous and bit asynchronous mapper for 168 VT1.5/TU- 11s or 126 VT2/TU-12s
  • Tributary path processor for 6 TU-3s
  • Mapper for 6 DS3s or 6 E3s (TU-3 and AU-3)

INTERFACES

  • Up to 4 SONET/SDH network interfaces
  • SONET/SDH Transport and Path overhead interface
  • Two 622-Mbit/s Extended Serial SONET/SDH Interfaces (ESSIs)
  • Line-side serial interface for up to 6 DS3s or E3s
  • System-side Scalable Bandwidth Interconnect (SBI) bus for high density interconnection of up to 168 T1 streams, 126 E1 streams, 6 DS3 streams, 6 E3 streams, or 6 arbitrary rate streams
  • System-side serial interface for up to 6 DS3s or E3s
  • Flexible bandwidth interface for up to 6 arbitrary rate ports
  • 32 Mbit/s Synchronous TDM Interface (based on H-MVIP)
  • Microprocessor- and IEEE 1149.1-compliant JTAG interface

PACKAGE

  • 896-pin FCBGA (31 x 31 mm)
  • Supports industrial temperature range (-40 °C to 85 °C).

Applications

  • ATCA/AMC-based line cards
  • Voice and media gateways
  • Wireless base station controllers (BSC) and radio network controllers (RNC)
  • Routers and multi-service switches
  • Edge aggregation switches
  • Multi-service provisioning platforms
 
 
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