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PM8310 TEMUX® 336
High Density T1/E1 Framer, VT/TU Mapper & M13 Mux with Integrated SONET/SDH Framers

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Version Issue Date

Product Brief

PDFPM8310 TEMUX 336 High Density T1/E1 Framer, VT/TU Mapper & M13 Mux with Integrated SONET/SDH Framers Product Brief [223 KB] PMC-2060576 2007-12-18 

Application Note

Locked Document, Log In RequiredPDFConfiguring SBI Compatible Devices [551 KB] PMC-2020180 2007-11-20 
Locked Document, Log In RequiredPDFAttaching Passive Heat Sinks to Organic Flip Chip Packages [142 KB] PMC-2020246 2007-05-02 

White Papers

PDFATCA Design Considerations for Telecommunication Platforms [815 KB] PMC-2081221 2008-08-14 

Symbols/Footprints

  Version Issue Date
Locked Document, Log In RequiredZipped FilePMC-2070143 PM8310 TEMUX 336 CAD Symbols and Footprints [518 KB]12007-01-26

Features

PRODUCT OVERVIEW

The PM8310 TEMUX 336 is a high density T1/E1 framer, VT/TU mapper, and M13 multiplexer with integrated SONET/SDH framers for OC- 12/STM-4 and 4xOC-3/STM-1 applications. Feature integration and scalability make the TEMUX 336 ideal for use in ATCA/AMC line cards, voice and media gateways, routers, and multi-service and edge aggregation switches.

The TEMUX 336 device's unique Extended Serial SONET/SDH Interface (ESSI) enables:

  • A low pin-count interconnect to additional TEMUX 336 devices for equipment protection applications
  • Higher-rate SONET/SDH framers such as the PM5336 ARROW 2488 for channelized OC-48/STM-16 designs
  • SONET/SDH cross-connects in transport applications
  • Ethernet over SONET/SDH mappers such as the PM4390 ARROW M8xFE

Additionally, the device's Scalable Bandwidth Interconnect (SBI) bus enables a simple interconnect to PMC-Sierra Layer 2 solutions such as the FREEDM (HDLC processor), S/UNI IMA (ATM inverse multiplexer) and AAL1gator (ATM-based CES processor) families.

BENEFITS

  • Complete SONET/SDH front end with T1/E1, DS3/E3 framers/mappers/ multiplexers on a single chip that meets ATCA/AMC space and power constraints
  • Integrated SBI bus simplifies interconnection to layer 2 processors
  • Meets timing requirements for wireless backhaul, critical for CESbased PWE3 applications, by enabling independent timing for all 336/252 T1/E1s across the SBI using the V4 byte
  • Extended Serial SONET/SDH Interface (ESSI) can aggregate up to 4x OC-3/STM-1 on a single 4-wire interface, enabling equipment protection in ACTA/AMC systems
  • Supports linear 1+1 protection on the same device or to a companion TEMUX 336 device
  • Enables a scalable architecture from T1/E1 up to OC-12/STM-4
  • Supports T1/E1 mapping directly into SONET/SDH using VT1.5/TU-11 or VT2/TU-12 or multiplexed in DS3s using M13 or G.747
  • Supports advanced test features including programmable pattern generation and detection for up to 64 byte sequences
  • Fully integrated, monolithic IC ensures reliability

PRODUCT HIGHLIGHTS

  • 8 OC-3/STM-1 or 2 OC-12/STM-4 SONET/SDH framers
  • 336 T1/252 E1 framers
  • 12 M13 multiplexers, including support for G.747 multiplexing
  • 12 DS3/E3 framers
  • High order path processor for a SONET STS-12 or an SDH STM-4
  • Tributary path processor for 336 VT1.5/TU-11s or 252 VT2/TU-12s
  • Byte-synchronous and bit-asynchronous mapper for 336 VT1.5/TU- 11s or 252 VT2/TU-12s
  • Tributary path processor for 12 TU-3s
  • Mapper for 12 DS3s or 12 E3s (TU-3 and AU-3)

INTERFACES

  • Up to 8 SONET/SDH Network interfaces; 2 may operate at OC-12/ STM-4 rates
  • SONET/SDH Transport and Path interfaces
  • Two 622-Mbit/s Extended Serial SONET/SDH interfaces
  • Line side serial interface for up to 12 DS3s or E3s
  • System-side Scaleable Bandwidth Interconnect (SBI) bus for high density interconnection of up to 336 T1 streams, 252 E1 streams, 12 DS3 streams, 12 E3 streams, or 12 arbitrary rate streams
  • System-side serial interface for up to 12 DS3s or E3s
  • Flexible bandwidth interface for up to 12 fractional rate links
  • 32 Mbit/s synchronous TDM interface (based on H-MVIP)
  • Microprocessor- and IEEE 1149.1-compliant JTAG interface
  • 16-bit microprocessor interface
  • Supports transparent virtual tributaries (TVT) where VT1.5/TU-11 and VT2/TU-12 payloads are transported intact between the line side and the SBI336 bus with pointer processing and low order path processing; TVT mode is configurable on a per-tributary basis
  • Provides optional jitter attenutation on the T1/E1 transmit and receive paths, and DS3/E3 transmit and receive paths including DS3/E3s demapped from SONET/SDH

PACKAGE

  • 896-pin FCBGA (31 x 31 mm)
  • Supports industrial temperature range (-40 °C to 85 °C).

Applications

  • ATCA/AMC-based line cards
  • Voice and media gateways
  • Wireless base station controllers (BSC) and radio network controllers (RNC)
  • Routers and multi-service switches
  • Edge aggregation switches
  • Multi-service provisioning platforms
 
 
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