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PM5376 TSE™ Nx160
Transmission Switch Element

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Version Issue Date

Product Brief

PDFPM5376 TSE-Nx160 Transmission Switch Element Short Form Data Sheet [93 KB] PMC-2020819 2005-02-18 

Application Note

Locked Document, Log In RequiredPDFAttaching Passive Heat Sinks to Organic Flip Chip Packages [142 KB] PMC-2020246 2007-05-02 
Locked Document, Log In RequiredPDFOptimizing Pre-emphasis and Receive Equalization for Backplanes [493 kB] PMC-2021098 2002-10-31 

Sales Collateral

Locked Document, Log In RequiredPDFNotice of Change - All FCBGA Packages to be Standardized to the HDBU Substrate Package Outline [695 KB] PMC-2062178 2006-10-19 

Symbols/Footprints

Locked Document, Log In RequiredPDFPM5376-FI TSE Nx160 1152 FCBGA CAD Symbols and Footprints [600 KB] PMC-2052243 2006-02-21 

Technical Overview

Locked Document, Log In RequiredPDFRASIO 3G for SONET/SDH Backplanes Technology Brief [64 kB] PMC-2030933 2003-05-29 

Symbols/Footprints

  Version Issue Date
Locked Document, Log In RequiredZipped FilePMC-2052243 PM5376-FI TSE Nx160 1152 FCBGA CAD Symbols and Footprints [600 KB]22006-02-21

Features

SWITCHING CAPACITY

  • Implements a 64-port memory switch fabric with STS-1/AU-3 switching granularity and scaling capability in a single device.
  • With a set of four devices, implements a 640 G 256-port single-stage switch fabric. With a set of two devices, implements a 320 G 128-port single-stage switch fabric.
  • Supports non-blocking anycast switching in all single stage configurations.
  • Supports fabric capacities greater than 640 G using multi-stage fabrics.
  • Provides two pages of connection memory with software and hardware controlled hitless page swaps at frame boundaries.
  • Supports trunk conditioning on a per port, per egress grain basis for AIS and UNEQ insertion.
  • Propagation of unselected ingress grains in the device can be optionally disabled to reduce device power consumption.

SWITCH PORT CONFIGURATION

  • Each ingress and egress link can be individually configured to support STS-48 or STS-12 equivalent flows using SONET scrambling over RASIO™ links.
  • Interfaces to industry standard components via 622 Mbit/s or 2.188 Gbit/s configured ports.
  • Interfaces to the TBS 2488 and the ARROW family of framers for di-bit, nibble, or byte switching.

CENTRALIZED OVERHEAD ACCESSIBILITY

  • Provides a high bandwidth interface with insert and extract access to all TOH bytes from all ports.
  • Provides a clock and data interface where the number of extracted and inserted TOH bytes is limited to 99 bytes per port selected for each ingress port.

IMPLEMENTS THE ESSI FRAME LAYER

  • Provides in-service link verification via bit interleaved parity (BIP-8) monitoring of the B1 byte.
  • Optionally generates standard B1 byte on egress flows.
  • Provides out of frame alignment status information for each ingress port.
  • Provides per link SONET-framed and unframed PRBS-23 generation and monitoring for offline link verification.

GLOBAL FRAME SYNCHRONIZATION

  • Provides two independent frame alignment planes.
  • Supports frame synchronization using ESSI smart framing or a global frame pulse input signal.
  • Compensates for differences in frame boundary arrival times between ingress ports using FIFOs and device level software configurable delay registers.

I/O AND GENERAL

  • Robust signal integrity over high speed links using PMC-Sierra's RASIO CML I/O for high speed serial ingress, egress, and transport overhead links. RASIO links are E-LVDS comptible.
  • Programmable pre-emphasis on transmit, equalization on receiver, and supports both AC and DC coupling.
  • Low power 1.2V CMOS core with 2.5V or 3.3V CMOS / TTL selectable digital inputs and outputs.
  • Low power consumption.
  • Generic 16-bit microprocessor bus interface for configuration, control, and status monitoring.
  • Standard 5 signal IEEE 1149.1 JTAG test port for boundary scan board testing.
  • 1152-FCBGA package.
  • Includes proprietary Transient Current Demand Management (TCDM)technology that simplifies power supply design.

Applications

  • Optical Cross-connects.
  • Multi-service Provisioning Platforms.
  • SONET/SDH Digital Cross-connects.
  • SONET/SDH Add/Drop Multiplexers.
  • SONET/SDH Terminal Multiplexers.
 
 
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